The Seibu MEX15 Water is an ultra-precision water wire EDM for small conductive components that require fine profiles, narrow slots, controlled taper, and repeatable feature location. Its deionized-water dielectric supports effective flushing and efficient cutting across micro tooling, precision inserts, lead-frame tooling, and other fine-feature applications.
The machine accepts wire from 0.0012 to 0.006 in. (0.03 to 0.15 mm) and provides 5.90 × 5.90 × 4.72 in. of X-Y-Z travel. A 26.46 lb workpiece limit, ±10-degree taper capacity at 2.36 in. thickness, and simultaneous four-axis control establish the working range for straight and tapered micro-EDM profiles.
Smart NC control and 0.01 µm command increments support precise programming and repeatable cut conditions. Shops evaluating the MEX15 Water should review material behavior in deionized water, flushing access, wire size, threading strategy, required finish, inspection capability, and expected throughput before finalizing the process.
| Standard Specifications | MEX15 Water |
|---|---|
| Max. workpiece dimensions (W × D × H) | 7.09 × 6.50 × 2.36 in. (180 × 165 × 60 mm) |
| Max. workpiece weight | 26.46 lb (12 kg), including fixture |
| Axis travel (X × Y × Z) | 5.90 × 5.90 × 4.72 in. (150 × 150 × 120 mm) |
| U-V axis travel | ±0.79 × ±0.79 in. (±20 × ±20 mm) |
| Max. taper angle | ±10° at 2.36 in. (60 mm) work thickness |
| Wire diameter range | 0.0012–0.006 in. (0.03–0.15 mm); 0.004 in. (0.10 mm) standard |
| Working fluid | Ion-exchanged (deionized) water |
| Control | Smart NC with 21.5 in. TFT multi-touch display |
| Least input / command increment | 0.01 µm |
| Machine dimensions (W × D × H) | 6.00 × 5.81 × 6.09 ft (1,830 × 1,770 × 1,855 mm) |
| Machine weight | 7,165 lb (3,250 kg) |
The Seibu America MEX15 Water is an ultra-precision water-dielectric wire EDM for micro tooling, precision inserts, lead-frame tooling, and small conductive components. It uses wire from 0.0012 to 0.006 in. (0.03 to 0.15 mm) and is specified for ±1 µm pitch accuracy, combining micro-wire capability with ion-exchanged-water flushing.
The MEX15 Water provides 5.90 × 5.90 × 4.72 in. of X-Y-Z travel, accepts workpieces up to 7.09 × 6.50 × 2.36 in. and 26.46 lb, and supports ±10-degree taper cutting at 2.36 in. thickness. Material response in water, flushing access, wire size, threading strategy, surface-finish target, inspection method, and production rate should guide final machine and process selection.
Parts and processes commonly evaluated for the MEX15 Water include:
Ion-exchanged water supports effective debris removal and is evaluated when flushing behavior and cutting efficiency are central to the application.
Wire down to 0.0012 in. (0.03 mm) supports narrow kerfs, fine slots, and small internal geometry within the MEX15 work envelope.
Simultaneous four-axis control and ±10-degree taper capacity support straight and tapered micro-EDM features when the cut plan and inspection method are properly qualified.
The MEX15 Water is suited to micro tooling, lead-frame tooling, precision inserts, miniature conductive parts, and fine profiles that benefit from effective flushing and controlled water-dielectric cutting.
Deionized water supports efficient debris removal and stable flushing during wire EDM. It is a practical choice when the material, geometry, finish requirement, and production target favor water-based processing.
Yes. Seibu specifies wire diameters from 0.0012 to 0.006 in. (0.03 to 0.15 mm). Fine-wire work requires qualified threading, flushing, cutting conditions, workpiece preparation, and inspection.
The published specification is ±10 degrees at a work thickness of 2.36 in. (60 mm). Actual taper performance should be verified against the part thickness, profile, wire diameter, finish, and accuracy requirement.
Both versions share the compact MEX15 envelope and ultra-precision positioning class. The main process difference is the dielectric: the Water model uses ion-exchanged water for flushing and efficient cutting, while the Oil model is evaluated for oil-specific surface, corrosion, and micro-feature requirements.